PCB Heat Lamination Buffer Pad

Siffar Sanpu Silicone Sponge Pad:

1.High Temperature Resistance & Thermal Stability Properties:Ban -foda kuma babu taurare bayan maimaita yawan zafin jiki{2}}

2.Rashin gurɓatawa & Abokan Muhalli:Shiga RoHS da FDA

3.An Rufe{1}Tsarin Kwayoyin Halitta:Lokacin aikin lamination, tururin ruwa da allunan ke fitarwa ba zai sha ba kuma ana iya fitar da su lafiya, rage lahani kamar kumfa, farar tabo da lalata.

4.Chemical kwanciyar hankali: Ba ya amsa da epoxy guduro ko PP prepreg guduro kuma ba zai lalata tagulla tsare.

Amfanin Soso Silicone Kamar yadda PCB zafi lamination pad

1. Kyakkyawan juriyar jiki don rama bambancin kauri na jan karfe da rashin daidaituwar allo
2. Rarraba matsi na Uniform, ƙarancin delamination, fanko, lahanin shigar jan ƙarfe
3. Babban juriya na zafin jiki da ingantaccen aikin thermal
4. Rufe -Tsarin tantanin halitta don kyakkyawan shayewar danshi
5. Low sulfur & low volatiles, low gurbatawa, tsabta samar
6. Maimaituwa, mai jujjuyawa{0}}, babban dacewa ga HDI, jan karfe mai nauyi, PCB mataki

Zaɓi Silikon Sanpu

1.We ne asali silicone soso maroki

2.We da fiye da shekaru 16 'kwarewa na silicone soso samar

3.M dole dubawa kafin barin factory, ingancin dubawa rahoton an haɗe

4.Free samfurori, tuntube mu don samun samfurin kyauta